Products
Very Low Profile Copper Foil (HVLP)
characteristic

1、Ultra low roughness.

2、Superior chemical resistance good etching factor.

3、Good high-temperature elongation.


suit

PTFE resin, hydrocarbon resin, PPO or PPE, high-frequency high-speed materials


application

5G high-speed signal transmission product, which can meet the requirements of medium loss, low loss The dem for ultra-low loss circuit boards.

type

VLP

HVLP

testmethod

copper thickness(µm)

9

12

15

18

35

9

12

15

18

IPC-TM-650


BASIS WEIGHT(g/m²)

80±5

105±5

133±5

150±5

280±5

80±5

105±5

133±5

150±5

Surface roughness µm

Smooth surface

Ra≤0.43

matte side(Rz)

3.0

3.0

3.5

3.5

4.0

2.5

2.5

2.5

2.52.5

peel strength(kgf/cm)

0.8

0.8

0.8

0.9

1.0

0.8

0.8

0.8

0.8

tensile strength

kg/mm²

ordinary temperature

28

high temperature180℃

15

Elongation rate(%

ordinary temperature

4

4

5

5

6

4

4

5

5

high temperature180℃

6

6

8

8

10

6

6

6

6

penetrating point/pinhole(individual/m²

penetrating point≤5,pinhole=0