Very Low Profile Copper Foil (HVLP)

1、Ultra low roughness.

2、Superior chemical resistance good etching factor.

3、Good high-temperature elongation.

PTFE resin, hydrocarbon resin, PPO or PPE, high-frequency high-speed materials

5G high-speed signal transmission product, which can meet the requirements of medium loss, low loss The dem for ultra-low loss circuit boards.

type		VLP					HVLP				testmethod
copper thickness（µm）		9	12	15	18	35	9	12	15	18	IPC-TM-650
BASIS WEIGHT（g/m²）		80±5	105±5	133±5	150±5	280±5	80±5	105±5	133±5	150±5
Surface roughness （µm	Smooth surface	Ra≤0.43
Surface roughness （µm	matte side(Rz)	≤3.0	≤3.0	≤3.5	≤3.5	≤4.0	≤2.5	≤2.5	≤2.5	≤2.52.5
peel strength（kgf/cm)		≥0.8	≥0.8	≥0.8	≥0.9	≥1.0	≥0.8	≥0.8	≥0.8	≥0.8
tensile strength （kg/mm²）	ordinary temperature	≥28
tensile strength （kg/mm²）	high temperature180℃	≥15
Elongation rate（%）	ordinary temperature	≥4	≥4	≥5	≥5	≥6	≥4	≥4	≥5	≥5
Elongation rate（%）	high temperature180℃	≥6	≥6	≥8	≥8	≥10	≥6	≥6	≥6	≥6
penetrating point/pinhole（individual/m²）		penetrating point≤5，pinhole=0