Products
High temperature high ductility HTE copper foil
characteristic

1、Uniform thickness high peel strength.

2、It has high temperature high ductility, which can avoid internal line breakage.

3、Excellent chemical resistance characteristics.


suit

Medium to high TG material, HDI board


application

Various copper foil substrates, IC carrier plates, high current heat dissipation substrates.

specifications(µm)

12

15

18L

18N

20

22

25

28

35L

35N

35P

50

60

70

BASIS WEIGHT(g/m²)

105±5

125±5

140±5

150±5

175±5

195±5

210±5

240±5

265±10

280±10

285±10

430±15

510±15

580±20

Surface roughness(µm)

Smooth surface(Ra)

Ra≤0.43

matte side(Rz)

6

7

8

8

8

8

10

12

12

13

13

14

14

14


peel strengthkgf/cm)

(base materialFR47628*4TG140)


1.1

1.1

1.15

1.2

1.3

1.3

1.3

1.4

1.4

1.5

1.5

2.1

2.3

2.3

tensile strength(kg/mm²

ordinary temperature

28

high temperature180℃

15

Elongation rate(%

ordinary temperature

3

3

4

4

4

4

5

5

6

6

6

8

10

10

high temperature180℃

2

2

3

3

3

3

3

3

3

3

3

3

3

3

penetrating point/pinhole(individual/m²

penetrating point≤5,pinhole=0

penetrating point≤3,pinhole=0

not have

not have

not have