1、Uniform thickness high peel strength.
2、It has high temperature high ductility, which can avoid internal line breakage.
3、Excellent chemical resistance characteristics.
Medium to high TG material, HDI board
Various copper foil substrates, IC carrier plates, high current heat dissipation substrates.
specifications(µm) | 12 | 15 | 18L | 18N | 20 | 22 | 25 | 28 | 35L | 35N | 35P | 50 | 60 | 70 | ||
BASIS WEIGHT(g/m²) | 105±5 | 125±5 | 140±5 | 150±5 | 175±5 | 195±5 | 210±5 | 240±5 | 265±10 | 280±10 | 285±10 | 430±15 | 510±15 | 580±20 | ||
Surface roughness(µm) | Smooth surface(Ra) | Ra≤0.43 | ||||||||||||||
matte side(Rz) | ≤6 | ≤7 | ≤8 | ≤8 | ≤8 | ≤8 | ≤10 | ≤12 | ≤12 | ≤13 | ≤13 | ≤14 | ≤14 | ≤14 | ||
peel strength(kgf/cm) (base materialFR4,7628*4,TG140) | ≥1.1 | ≥1.1 | ≥1.15 | ≥1.2 | ≥1.3 | ≥1.3 | ≥1.3 | ≥1.4 | ≥1.4 | ≥1.5 | ≥1.5 | ≥2.1 | ≥2.3 | ≥2.3 | ||
tensile strength(kg/mm²) | ordinary temperature | ≥28 | ||||||||||||||
high temperature180℃ | ≥15 | |||||||||||||||
Elongation rate(%) | ordinary temperature | ≥3 | ≥3 | ≥4 | ≥4 | ≥4 | ≥4 | ≥5 | ≥5 | ≥6 | ≥6 | ≥6 | ≥8 | ≥10 | ≥10 | |
high temperature180℃ | ≥2 | ≥2 | ≥3 | ≥3 | ≥3 | ≥3 | ≥3 | ≥3 | ≥3 | ≥3 | ≥3 | ≥3 | ≥3 | ≥3 | ||
penetrating point/pinhole(individual/m²) | penetrating point≤5,pinhole=0 | penetrating point≤3,pinhole=0 | not have | not have | not have |